Insulated Bonding Wire

The drive for smaller components, increasing system functionality and cost reduction are all competing demands in the electronics industry. To help chip designers and manufacturers address these competing demands, an insulated wire bonding technology known as X-Wire™ has been developed by a Canadian company, Microbonds Inc in cooperation with several leading gold bonding wire companies around the world.

Microbonds’ X-Wire™ Technology consists of a proprietary insulation applied to bare bonding wires. The technology overcomes the inherent limitations of bare wire bonding interconnections which have to be designed to ensure that the bare wires do not touch, so avoiding short circuits. In contrast when using insulated wire, chip designers can reduce the criticality of wire clearance, allowing for previously impossible chip designs to be realised. Insulated bonding wires have been added to the electronic industry’s technology roadmap (2006 ITRS Roadmap.)

X-Wire™ has been successfully tested by industry participants for bond integrity, intermetallic formation, wire bonding yield and reliability. Tanaka Denshi Kogyo K.K., the leading global supplier of gold bonding wire have just certified the technology readiness of Tanaka to manufacture X-Wire™ from its Saga, Japan production facilities.

For more information contact sales@microbonds.com