Friday, 22nd December 2006 (4053 views)

Pac Tech, a German based microelectronics company, has opened a new facility in Malaysia which will contain the special applications needed by semiconductor manufacturers including various gold-based technologies.

The 40,000 square foot building in Penang will house state-of-the-art bumping and backend processing for companies with produce semi-conductors in the Pacific Rim area.

Designed and laid out to accommodate mass production, it is expected to handle 600,000 wafers every year and will support advanced applications such as gold mineralisation for today's MOSFET devices as well as gold bonding.

Tall gold bumping for Smart Card and Smart Label will also be offered at the plant which can accommodate up to 300 millimetre water processing capability.

Due to open in June 2007, water forecasts are being taken now in order to properly timetable production planning.

Dr Elke Zakel, president of Pac Tech, said: "This new Asian facility is the next step in our worldwide support for the most cost-effective source of wafer bumping and backend processing in the world.

"This Malaysian facility is just the latest in our efforts to accomplish that goal."

 

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