Wednesday, 5th September 2007 (2731 views)

Mechanised equipment manufacturer Palomar Technologies has announced that it is to display its Model 8000 for high throughput automated gold ball bumping in Taiwan later this month.

According to Palomar, this model represents the latest advances in gold ball bumpers.

The Model 8000 is a gold ball-and-stitch thermosonic wire bonder for "complex, precision interconnects", Palomar reveals, specifically in instances where flexibility and ease of programming is required.

"At Semicon Taiwan, the model 8000 will feature dual wafer stages, an improved operator interface and LCD programming screen," Palomar notes.

Palomar claims that its co-planar gold bumper is the only gold bumper that can produce planarised gold bumps in one step, using a patented bond-head motion to make exact gold bumps by trimming the wire off the top of the bump without leaving surplus, in a repeated fashion.

In this manner it removes the need for secondary coining by enabling the configuration of flat bumps.

In 2005, Palomar won the Editors' Choice Best Product Award from Semiconductor International magazine for its precision gold wire bonder and ball bumper.

 

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