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2003
GOLD2003 New Industrial Applications for GoldThere is a great deal of innovative research into gold science and technology currently being undertaken in universities and industrial research laboratories around the world. Gold catalysis is a major new emerging science, and the first international conference was held on this subject 2 years ago under the title "Catalytic Gold" in Cape Town. There are also exciting developments in gold chemistry, nanotechnology and materials, which offer unique opportunities for new products and processes using gold. As a result, there is a need to ensure that this new emerging science is brought to the attention of industry in order to encourage its commercial exploitation to the benefit of mankind. That was one of the principal aims of the GOLD 2003 : New Industrial Applications for Gold conference which took place in Vancouver, Canada between the 28th September and 1st October 2003. The Conference Organising Committee were greatly encouraged by the participation of both researchers and industrialists at the event. Four parallel sessions were run at the conference and over 150 high quality papers and posters were presented and discussed. This confirmed that the gold R & D community needs a dedicated forum to discuss the latest advances in gold science and technology and it is anticipated that significant progress in many of the technologies discussed in Vancouver will be revealed at the next conference anticipated to take place somewhere in Europe during 2006. Gold may be the oldest metal known and utilised by man, but it is also most definitely a 21st century metal, suited to modern technological needs! |
![]() The blog that crosses the boundaries between research and the industrial application of gold technology SEMICON China10 Mar, 2010 World Gold Council, is helping to train engineers and chip designers in the technology of wire bonding. At next week’s SEMICON China 2010 we are sponsoring a seminar entitled ‘Materials Science of Wire Bonding & Wire Bond Reliability’ in conjunction with SEMI. This will include best practice in wire bonding technology and materials selection issues. [...] |